The Hong Kong Monetary Authority (HKMA) announced a tender of RMB750 million in 2-year institutional government bonds through a re-opening of an existing 3-year bond issue on Thursday, 13 August 2026. The bonds, issued under the Infrastructure Bond Programme, will settle on 17 August 2026 and mature on 28 July 2028, carrying an interest rate of 1.59% per annum payable semi-annually.
- Issue Number: 03GB2807001
- Stock Code: 85039 (HKGB1.59 2807-R)
- Tender Date: Thursday, 13 August 2026, 9:30 am to 10:30 am
- Minimum Tender Amount: RMB50,000 or integral multiples thereof
- Indicative Yield: 1.452% (semi-annualised)
- Accrued Interest: RMB43.56 per RMB50,000 minimum denomination
The tender will operate on a competitive basis and is restricted to Primary Dealers appointed under the Infrastructure Bond Programme. Investors wishing to participate must submit applications through an accredited Primary Dealer, with the latest published list available on the Hong Kong Government Bonds website. Tender results will be released by 3:00 pm on the tender day across the HKMA website, Bloomberg, and Refinitiv platforms.
The new issuance is fully fungible with the existing 03GB2807001 bond listed on the Stock Exchange of Hong Kong, allowing seamless integration with current holdings. Proceeds from the bond offering will be directed toward infrastructure projects in accordance with the Infrastructure Bond Framework, reinforcing Hong Kong’s commitment to financing long-term development initiatives.
The HKMA administers Hong Kong’s monetary policy and manages the currency peg to the U.S. dollar while overseeing the development of government bond markets.
