The Hong Kong Monetary Authority (HKMA) announced a competitive tender for RMB1.25 billion in 7-year institutional government bonds on Thursday, 13 August 2026, with settlement scheduled for 17 August 2026. The bonds, issued under the Infrastructure Bond Programme, represent a re-opening of existing issue 07GB3306001 and will mature on 29 June 2033, carrying a fixed coupon of 1.78% payable semi-annually.
- Tender Date: Thursday, 13 August 2026, 9:30 am to 10:30 am
- Settlement Date: Monday, 17 August 2026
- Indicative Pricing: 100.99 with semi-annualised yield of 1.627%
- Minimum Tender Amount: RMB50,000 or integral multiples thereof
- Stock Code: 85138 (HKGB1.78 3306-R)
Participation in the tender is restricted to Primary Dealers designated under the Infrastructure Bond Programme. Investors seeking to apply must submit applications through an approved Primary Dealer, with the complete list available on the Hong Kong Government Bonds website.
Accrued interest payable on the settlement date totals RMB119.48 per minimum denomination of RMB50,000. The newly issued bonds will be fully fungible with the existing 07GB3306001 issue and eligible for listing and trading on the Stock Exchange of Hong Kong.
The tender follows the HKMA‘s Infrastructure Bond Programme framework, with proceeds designated for investment in infrastructure projects across Hong Kong. Tender results will be published by 3:00 pm on the tender day via the HKMA website, the Hong Government Bonds website, Bloomberg (GBHK <GO>), and Refinitiv platforms, ensuring transparent price discovery and immediate market access for successful bidders.
